Plasma-Therm’s LAPECVD™ (Large Area Plasma Enhanced Chemical Vapor Deposition) uses a cassette-to-cassette configuration to allow for high-volume production in a wide range of applications. The LAPECVD™ platform can be used to deposit a variety of thin-film materials with its parallel-plate plasma deposition system.

Hardware

• Cassette-to-Cassette Handling
• Multi-substrate batch processing
• Dual cassettes
• Platen heating up to 350°C
• Upper electrode RF power at 13.56 MHz with optional MFD
• Up to 8 gas channels with digital MFCs
• Thermally managed reactor design—up to 175°C for internal walls and shower head

Endpoint

• Integrated multifunctional endpoint capability with EndpointWorks.
• Unique OEI application for real-time film thickness and rate monitoring.
• OES for optimized chamber clean.

Software

• User friendly software
• Comprehensive data logging
• Automated cleaning program
• Real-time process data display
• Fully integrated endpoint system
• Factory automation compatible (SECS/GEM)
• Edit recipes during runs
• Multiple user access levels
• Alarm history

Process

• Stress control
• High uniformity
• Low damage
• Low particulates
• Tunable index
• Increased productivity with batch loading capability
• Low temperature