Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher^® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher^® solution is a key enabler of Moore’s law and shrinking technology nodes. A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems. Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm.

Mask Etcher 2-V Evolution
Mask Etcher® Gen 2 Gen 3 Gen 4 GenV Node (nm) 180 130-90 65-45 32-22

 

Hardware

• Dedicated platform specifically built for the highly specialized photomask market
• Several front-end handling options: - Ballroom/Bulkhead mounting - Automated load station (ALS) - SMIF on Automated Frond End (AFE)

Endpoint

Integrated multifunctional endpoint capability with EndpointWorks

• Laser Interferometry
• OES
• System Parameters
• Custom input (e.g. RGA)

Software

• User friendly SEMI standard interface
• Comprehensive data logging
• Real-time process data display
• Fully integrated endpoint system
• Factory automation compatible (SECS/GEM)
• Multiple user access levels
• Alarm history

Process

• • Compensation for uniformity and loading effect
  • Low etch bias
  • Good feature fidelity
  • Low particle and defect
  • Low line edge roughness
  • Maximized productivity and low cost of ownership