They are designed to clean and to develop wafers up to 8” or substrates up to 6” x6 ” (150 x 150mm). The process chamber works up to Ø 212mm.

 

FEATURES (BASIC CONFIGURATION)

• Up to 50 programmes with 24 segments each can be programmed
• Quick start function for repeat processes
• User-friendly process configuration with touch screen panel
• Process parameter: speed (rpm), acceleration, time (sec.), spray-time developer(sec.), speed of spray arm, rins and N2 drying
• Electrical driven spray arm, with dynamic or static function
• Developer line and media tank for one developer included (up to 4 developer lines possible)
• Nozzle for DI-water-rinse and N2 drying on the spray arm
• Control elements for compressed air and vacuum for dispensing included
• Closed process chamber for process safety
• Manual loading and unloading of the substrates
• Mechanical substrate fixation
• Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

• Additional developer line
• Developer tank heating system (2 ltr.)
• Spray nozzle made of PEEK (0,3 / 0,5mm)