Developer SMD-200-E
They are designed to clean and to etch wafers up to 8” or substrates up to 6” x6 ” (150 x 150mm). The process chamber works up to Ø 212mm.
- Up to 50 programmes with 24 segments each can be programmed
- Quick start function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameter: speed (rpm), acceleration, time (sec.), spray-time developer(sec.), speed of spray arm, rins and N2 drying
- Electrical driven spray arm, with dynamic or static function
- Developer line and media tank for one developer included (up to 4 developer lines possible)
- Nozzle for DI-water-rinse and N2 drying on the spray arm
- Control elements for compressed air and vacuum for dispensing included
- Closed process chamber for process safety
- Manual loading and unloading of the substrates
- Mechanical substrate fixation
- Acoustic signal when the process has finished
- Additional developer line
- Developer tank heating system (2 ltr.)
- Spray nozzle made of stainless steel (0,3 / 0,5mm)